Study Persiapan Permukaan Logam Menggunakan HCl dan Tanpa HCl pada Pelapisan Baja Karbon Rendah Menggunakan Kaca Bekas dengan Variasi Amplas 400, 600, 1000 ( mesh )

Wardoyo, Teguh and , Patna Partono, S.T., M.T. (2018) Study Persiapan Permukaan Logam Menggunakan HCl dan Tanpa HCl pada Pelapisan Baja Karbon Rendah Menggunakan Kaca Bekas dengan Variasi Amplas 400, 600, 1000 ( mesh ). Skripsi thesis, Universitas Muhammadiyah Surakarta.

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Abstract

This study aims to determine the chemical composition of the glass compiler and then compare it with the standard chemical composition for enamling glass. In this study also aims to determine the effect of HCl & non HCl on low carbon steel. by looking at the microstructure and adhesion between enamels and low carbon steel surfaces. This study uses SEM (Scaning Electron Microscope) test to determine the chemical composition of the glass. Whereas to determine the effect of HCl and without HCl on low carbon steel surfaces, surface roughness testing and micro photo testing were carried out. To find out the results of glass coating adhesion the testing carried out is bonding testing in accordance with European Standard EN10209. From the test results it can be concluded that the glass that can be used in glass coating is only glass which has a chemical composition close to the standard enamel glass chemical composition which contains a low percentage of silica and a fairly high percentage of alumina and floor. In microstructure and bonding testing of the effect of HCl and without HCl on low carbon steel surfaces, the strength of bonding results were best obtained for the duration of metal dipping on metals dipped in HCl liquid. Keywords : glass coating, low carbon, HCl, strength of bonding

Item Type:	Karya ilmiah (Skripsi)
Uncontrolled Keywords:	HCl, Baja, Lapisan
Subjects:	T Technology > TP Chemical technology
Divisions:	Fakultas Teknik > Teknik Mesin
Depositing User:	TEGUH WARDOYO
Date Deposited:	13 Nov 2018 06:33
Last Modified:	13 Nov 2018 06:33
URI:	http://eprints.ums.ac.id/id/eprint/68575

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