Studi Perilaku Wrinkling dan Thinning Pada Proses Stamping Top Outer Hatchback Dengan Material SCGA dan SPCC

Wahyanti, Sri and , Agus Dwi Anggono, ST, M.Eng, Ph.D and , Ir. Waluyo Adi Siswanto, M.Eng, Ph.D (2020) Studi Perilaku Wrinkling dan Thinning Pada Proses Stamping Top Outer Hatchback Dengan Material SCGA dan SPCC. Thesis thesis, Universitas Muhammadiyah Surakarta.

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Abstract

The objective of the research is to determine the changes in wrinkling and thinning behavior in the stamping process of the top outer hatchback. The study was conducted using two types of materials, i.e., SCGA (Steel Cold rolled Galvanized Annealed) and SPCC (Steel Plate Cold rolled Coiled) with a thickness of 0.80 mm. During the stamping process, the coefficient of friction values varied of 0.0, 0.05, 0.10, and 0.15 for each material. The stamping process was carried out by using the simulation method to investigate the wrinkling and thinning behavior. The forming limit diagram (FLD) provides information on material changes and the amount of safe and unsafe areas on the blank. The results showed that in the fifth step, the parts that experienced high values of major-minor stress and strains, thinning, and wrinkling decreased in the last step. That caused by removing unused areas after the trimming process. Therefore, the safe zone of SCGA was increased from 9.52% to 18.19%. For the SPCC material, the safe area increased from 8.63% to 16.31%. The coefficient of friction affects the thinning and wrinkling defects. The greater of the friction coefficient will increase the value of thinning and wrinkling. Based on the Non-Linear FLD analysis, both materials SCGA and SPCC are still in a safe condition.

Item Type:	Karya ilmiah (Thesis)
Uncontrolled Keywords:	Deep Drawing, Thinning, Wrinkling, AutoForm
Subjects:	T Technology > TS Manufactures
Divisions:	Fakultas Pasca Sarjana > Magister Teknik Mesin
Depositing User:	Unnamed user with username u100170033
Date Deposited:	18 Jun 2020 05:27
Last Modified:	18 Jun 2020 05:27
URI:	http://eprints.ums.ac.id/id/eprint/82740

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